Industry News, Trends and Technology, and Standards Updates

During the week of SEMICON West in San Francisco this past July, the North American Information & Control Committee met to discuss and consider new and pending standards within the industry. SEMATECH was noticeably absent from the sessions. For many years, SEMATECH has been a leader in developing and promoting the GEM 300 and EDA standards.

Here are the highlights from those meetings and how they will effect you.

The DDA Task Force is in the early stages of planning a Freeze 3 version of the EDA (Interface A) standards. This may cause some concern—especially with OEMs—as some are just now getting their Freeze 1 interfaces accepted in Fabs. Freeze 2 was a big step forward in making the standards clearer and easier to adopt, but it required a lot of work to move from Freeze 1 to Freeze 2. The hope is that the transition from Freeze 2 to Freeze 3 will be easier, but there will be doubt and concern among many OEMs.

One of the changes proposed for Freeze 3 is replacing the usage of SSL (HTTP) with WS-Security, an extension to SOAP and a member of the web services specifications published by OASIS. This extension allows for secure data within a SOAP message, while still using HTTP for data transfer. This is really an underlying issue and should not affect the applications that would interface with our CIMPortal Plus product. It would allow for a secure connection between CIMPortal and the Fab client so that the data transmitted is protected from theft. There would be configuration changes required to allow the secure connection to be defined, but—once it is—the actual interaction between the OEM’s application and CIMPortal Plus should not change.

Another change being considered is the implementation of WS-ReliableMessaging, another extension to SOAP and also a member of the web services specifications published by OASIS. WS-ReliableMessaging describes a protocol that allows SOAP messages to be reliably delivered between distributed applications in the presence of software component, system, or network failures. Just as the WS-Security item above, this would be at the protocol level, an “under-the-hood” change. It should not affect the way applications interact with our product, but should provide for a more reliable connection to the host EDA client. Use of this extension could also allow EDA to be used in more factory applications, where guaranteed data acquisition is required.

The final issue that was discussed relating to Freeze 3 was a new high-frequency trace for collecting data at very high speeds triggered for short periods of time where the collected data is sent at the end of the collection period. For example, a 1 ms trace for 5 seconds where the 5,000 collected samples for each parameter would be sent at the end of the 5 second period. This change might require alterations in our products. This will help the data reporting be more efficient. Rather than reporting small individual pieces of data to the EDA client, this will allow many data samples to be sent together making for more efficient use of the network.

The GEM 300 Task Force had three ballots on hold due to the ongoing SML copyright legal trial between SEMI and The PEER Group. However, work on other pending ballots continued. The first, Ballot 5872, proposes to add new features to the E172 SEDD standard. E172 is a new standard that provides an XML schema for documenting a GEM/GEM 300 interface. Eventually, E172 can completely replace the current GEM documentation requirements.

Recipe Integrity ballot 5618 has an uncertain future since ISMI failed to pursue its development; unfortunately, the ballot had seemed very close to completion. This standard says that it will not require changes to SECS II messages, but simply clarifies what parameters are defined and how the existing pieces work together. So, essentially, it would be a standard that tells you how to use other existing standards.

Finally, the Task Force discussed enhancing the GEM 300 standards to handle equipment that bond substrates and divide substrates. This will affect E90 and could affect E40, E87, and E94 as well. These changes would likely require updates to CIM300. Right now the standards just address how to treat equipment where the same material (substrates or wafers) go in and out. Traditional material tracking assumes one wafer in, get processed, then return to an output carrier. In the proposed case, either two wafers go in and one unit comes out, or one substrate goes in and two come out

The committee is scheduled to next meet in November, so you can plan on seeing another post from me on the outcome of those meetings afterwards. Subscribe to our blog in the upper right corner of this page to be sure not to miss that or any of my future updates on the North American Information & Control Committee.

As mentioned briefly in a previous posting, the adoption momentum for the SEMI EDA (Equipment Data Acquisition) suite of standards has picked up noticeably over the past 6 months, and a number of pilot projects are now underway at leading chip makers across the industry, especially in Asia. As these projects bear fruit, we expect to see explicit requirements for EDA interface capability in the purchase specifications of many more fabs in the coming months. But that’s just a start.

The early adopters of these standards who have now accumulated years of production experience clearly understand that the key to realizing the full manufacturing benefit of this technology lies in the structure and content of the equipment metadata models, which to date have been largely determined by the equipment suppliers themselves. The resulting diversity of EDA implementations is reminiscent of the situation that existed in the days before GEM, when every chip maker required their own particular “dialect” of SECS-II, and the equipment suppliers had to support a custom interface for each customer… not a pretty picture.

Luckily, the standards community recognized this problem early on, and addressed it via the Specification for EDA Common Metadata (SEMI E164). This standard effectively unifies the equipment models across the fab, regardless of process type or supplier, enabling the factory software developers to create generic manufacturing applications that “plug and play” with the equipment to address the problems that are common to all (status and productivity monitoring, material flow, resource utilization, etc.). 

As a result, the next wave of factory implementations can directly leverage these lessons learned by requiring compliance to “Freeze 2, E164” level of the EDA standards suite, and focus their energies on new application development rather than supplier-specific custom integration software. Given the years of experience Cimetrix has dedicated both to the development of the EDA standards in the SEMI community and in providing product-based implementations on “both ends of the wire” (in other words, equipment and client/host side), we can support customers wherever they are in the implementation life cycle, from building awareness to initial purchase specification development to system architecture and application design to conformance and acceptance testing.

For more information about how we can help align your activities with this accelerating adoption process, please contact us… and stay tuned for more specifics on all the above!

For an introduction to EDA, download the presentation Interface A Overview: Characteristics, Benefits, and Applications.

The 2015 SEMICON Taiwan was held at the Taipei Nangang Exhibition Center in the Nangang District of Taipei City, Taiwan September 2-4.  The event drew over 30,000 visitors from all over the world for the three-day event with nearly 1,500 exhibits from a diverse array of companies and organizations across the semiconductor industry.

Cimetrix exhibited at SEMICON Taiwan trade show for the first time, in conjunction with its newest Asian partner, Flagship International.

This turned out to be the 20^th Anniversary of SEMICON Taiwan, so the mood was especially buoyant and the attendance brisk. SEMI also commemorated the event with a Gala Dinner at the Grand Hyatt on Wednesday night, and we were privileged to attend courtesy of our Flagship colleagues.

The president of Taiwan, Ma Ying-jeou, even made a guest appearance to thank the semiconductor industry for its contribution to Taiwan’s economic health. 

Shortly after the exhibition opened on Wednesday (Sept. 2), a couple of visitors from UMC showed up, and shared the latest work they’ve been doing with the Wait Time Waste (WTW) concepts that we had presented two years earlier. C.Y. Tiao and James Lin of UMC even made two presentations at the eMDC conference on this topic. 

From a standards perspective, this has now taken the form of SEMI E168, Specification for Product Time Measurement (PTM), and has been defined at the “time element” and supporting GEM/SECS message level for process equipment, automated material handling systems (AMHS), and material control systems (MCS). With the advent of SEMI E164 (EDA Common Metadata), these concepts are especially easy to implement, because all the events necessary to calculate the full suite of time elements are required by standard… but more on this is a later blog!

Since much of the world’s foundry capacity is in Taiwan, the equipment industry was well represented at the show, which included many of Cimetrix’ current customers as well as a few local prospects. As a result, Dave Faulkner and Kerry Iwamoto had a chance to visit a number of these firsthand.

Another highlight of the week for Cimetrix was participation in the eMDC (e-Manufacturing & Design Collaboration Symposium), where I made a presentation entitled “Data Fusion at the Source: Standards and Technologies for Seamless Sensor Integration” that addresses the challenges faced by process engineers in effectively using data from an increasing number of sources to analyze process behavior.

The basic idea is to handle the association of necessary context information (lot, substrate, product, layer, process, recipe, step, chamber, etc.) with the raw collected data as close to the source as possible, using a single, integrated model of the equipment and all related data sources. The equipment model that forms the foundation of the EDA/Interface A standards serves this purpose perfectly.

 

On a final related note, in visiting and talking with a number of the leading chip makers during the week, it seems that the adoption momentum for EDA is now building steadily, so we look forward to supporting this initiative across the value chain. Stay tuned for a late September post that will shed more light on this process!

It was exciting to be at SEMICON Japan a couple of weeks ago. The show was in a new venue – Tokyo Big Sight; in previous years, it had been at the International Exhibition Halls & International Conference Hall in Tokyo.

 

Tokyo Big Sight

I was especially interested in seeing some of our equipment supplier customers, since we have several new customers who have completed their systems and will ship products using Cimetrix software in 2015 using both our Interface A and SECS/GEM software.

We were well represented at the show. We had a large presence in the booths of our distributors in Japan.

 

Both Meidensha and Rorze had banks of computers set up to demonstrate Cimetrix software, and both booths were busy with demos.

SEMICON Japan was first held in 1977, and is the largest of the SEMICON events held worldwide each year. This year, there were forums covering subjects such as:

• Recent advances in 2.5D/3D ICs
• TSVs in 2.5D and 3D
• IoT (Internet of Things) and its application
• Advanced Lithography
• Design For Manufacturing (DFM)

You can read more about the event at SEMICON Japan.

As we move into the third quarter of 2013, the expectation is that semiconductor equipment total year revenues will decline somewhere between 1.5% and 7.5% from the $36.9 million in 2012. We are seeing equipment suppliers being a bit cautious about Q3 of this year. Several companies are offering guidance of no growth this quarter.

The forecast for 2014 continues to be upbeat, with SEMI expecting equipment revenue up by 21% and VLSI Research calling for a 27% increase. The majority of that growth will be in wafer processing equipment, which is expected to increase by 24% from 2013 levels.

Here is the chart provided by SEMI in July (see SEMI Sees 21% Increase in Chip Equipment Spending for 2014):

 

Another encouraging sign is the SEMI North American book-to-bill ratio has remained above 1 for the past six months (see North American Semiconductor Equipment Industry Posts June 2013 Book-to-Bill Ratio of 1.10).

North American Semiconductor Industry Bookings and Billings ($M)

The above chart shows that bookings have been going up since November 2012, and, since January 2013, more orders were received compared to products that were shipped, meaning that the industry is growing.

The question is “What is fueling this drive to build more capacity?” The answer is demand for mobile computing and communication. SIA (the Semiconductor Industry Association) announced worldwide sales of semiconductors in May 2013 of $24.70 billion, an increase of 4.6%. That is the largest sequential monthly increase in sales for the industry since March 2010.

IDC forecasts the mobile wireless communication segment will grow over 10% in 2013, and the consumer segment, including tablet computers, e-readers, set top boxes, and DVD recorders, will grow over 15% this year. Even automobiles are getting smarter, and semiconductor content will grow over 5% in vehicles this year (see IDC Forecasts Worldwide Semiconductor Revenue Will Grow 6.9% and Reach $320 Billion in 2013).

We are in a cyclical industry, and we know that what goes up must come down. If the analysts are correct, next year should be a robust year for semiconductor equipment makers. We will keep you posted on what we are seeing in the semiconductor equipment industry.